Awards & Recognitions

2025

Heterogeneous Multi Robot Systems for Intelligent Marine Life Observation - Lin Hin Wang, Wang Pengyu, Zhang Fan, Yim Ying Hing, Du Xiawei, LI Jialu, Kui Ka Yu, Leung Ka Chun, Li Chun Kit
The 11th Hong Kong University Student Innovation and Entrepreneurship Competition - Innovation Track (Information Technology), Second Prize

Heterogeneous Multi Robot Systems for Intelligent Marine Life Observation - Lin Hin Wang, Wang Pengyu, Zhang Fan, Yim Ying Hing, Du Xiawei, LI Jialu, Kui Ka Yu, Leung Ka Chun, Li Chun Kit

School of Engineering (SENG), School of Science, The Fok Ying Tung Graduate School
SafeSteps - Sile FANG, Wenhao YE, Haolun HUANG, Yihe ZOU

SafeSteps - Sile FANG, Wenhao YE, Haolun HUANG, Yihe ZOU

School of Business and Management, School of Engineering (SENG)
Team HAAR - Ruth KPALMA, Andrea CHIA, YAU Hoi Ting, and Alby LAU (SGFN students)

Team HAAR - Ruth KPALMA, Andrea CHIA, YAU Hoi Ting, and Alby LAU (SGFN students)

RiceFort - Lydia Lai Ting LAM, Leong LEUNG

RiceFort - Lydia Lai Ting LAM, Leong LEUNG

School of Business and Management
LI Lin Ying, LUN Ka Hei Amelia and MA Lok Yiu
HKGCC Business Case Competition - Chinachem Group Case First Runner-up

LI Lin Ying, LUN Ka Hei Amelia and MA Lok Yiu

School of Business and Management
ePropulsion - Danny Tao

ePropulsion - Danny Tao

School of Engineering (SENG)
Sign Language Translation AI - Hao LIU, Aaliya RAZA

Sign Language Translation AI - Hao LIU, Aaliya RAZA

School of Engineering (SENG)
Celery CHAN, Evelyn HUANG, Emily LAM, and Tersa YUEN
CFA Institute Research Challenge - First Runner-up

Celery CHAN, Evelyn HUANG, Emily LAM, and Tersa YUEN

School of Business and Management
LLM Anime characters HIKARI - Jiayun LI, Miu Wan YEUNG, Hei Chung YAU

LLM Anime characters HIKARI - Jiayun LI, Miu Wan YEUNG, Hei Chung YAU

School of Engineering (SENG)
Next Generation of 3D Bioprinting through A Multimodule Integrated Platform - LIU Shishuo, WANG Chongrui, YIN Xi, DONG Bin, ZENG Ruiyi, ZHANG Zhanjie

Next Generation of 3D Bioprinting through A Multimodule Integrated Platform - LIU Shishuo, WANG Chongrui, YIN Xi, DONG Bin, ZENG Ruiyi, ZHANG Zhanjie

School of Engineering (SENG)